Apple's M5 chip exposed for the first time: manufactured by TSMC and used in artificial intelligence servers

Apple | 06/07/2024

According to media reports, Apple's M5 series chips will be manufactured by TSMC and use TSMC's most advanced SoIC-X packaging technology for artificial intelligence servers.

Apple expects to mass-produce the M5 chip in the second half of next year, by which time TSMC will significantly increase SoIC production capacity.

Apple is currently using M2 Ultra chips in its AI server clusters, and it is expected that the usage may reach around 200,000 this year.

As part of TSMC's advanced packaging technology portfolio 3D Fabric, TSMC SoIC is the industry's first high-density 3D chiplet stacking technology. SoIC is the "most cutting-edge 3D packaging" technology.

It is reported that the SoIC design allows chips to be stacked directly on the chip. The minimum bump pitch of TSMC's 3D SoIC can reach 6um, ranking first among all packaging technologies.

Compared with CoWoS and InFo technologies, SoIC can provide higher packaging density, smaller bonding spacing, and can be shared with CoWoS/InFo. CoWoS/InFo packaging based on SoIC will bring smaller chip size and realize the integration of multiple small chips.

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