Utilize a stereoscopic microscope for comprehensive 360° observation, examining aspects such as product packaging, chip type, date, batch, printing, packaging state, and pin arrangement. Visual inspection enables quick assessment of compliance with original brand manufacturers external requirements, including anti-static and moisture standards, for both new and refurbished products.

This is crucial for functionality, especially in hot, humid regions. It assesses oxidation, prevalent in places like Southeast Asia and southern North America. We follow J-STD-002 standards for thru-hole, surface mount, and BGA devices. We use "dip-and-look" for non-BGA surface mount devices and the "ceramic plate test" for BGA devices. Testing is recommended for devices in improper packaging, those over a year old, or showing pin contamination.

X-ray inspection provides comprehensive 360° observation of component internals and package connections. It identifies issues like mix-ups and ensures conformity with specifications (Datasheet). This method assesses chip and package pin connectivity, detecting abnormalities and ruling out key and open-wire short circuits.

We design and test ICs comprehensively through official datasheets, developing test projects, building testing boards and platforms, and writing test programs. Our professional chip function tests cover logic, analog, high-frequency, and power ICs, as well as various amplifiers and power management ICs. We handle diverse packages like DIP, SOP, BGA, SOT, QFN, and QFP. Our programming equipment supports detection of 47,000 IC models from 208 manufacturers, including EPROM, EEPROM, FPGA, flash, microcontroller, and standard logic devices.